Analysis of average thermal stresses in passivated metal interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371658
Reference14 articles.
1. Thermal Stresses in Passivated AlSiCu-Lines From Wafer Curvature Measurement
2. Analysis Of Stresses And Strains In Passivated Metal Lines
3. Finite Element Calculations of Strains in Passivated Metal Lines
4. The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu Lines
5. Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers
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