Dissolution and diffusion behavior of Al2O3 in a CaO–Al2O3–SiO2 liquid: An experimental-numerical approach
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2786854
Reference27 articles.
1. “In-situ” Real Time Observation of Planar to Cellular and Cellular to Dendritic Transition of Crystals Growing in Fe–C Alloy Melts
2. "In-situ" Observation of Collision, Agglomeration and Cluster Formation of Alumina Inclusion Particles on Steel Melts.
3. Characteristics of Agglomeration of Various Inclusion Particles on Molten Steel Surface.
4. In Situ Observation of the Role of Alumina Particles on the Crvstallization Behavior of Slags.
5. Use of the Boltzmann Equation to Simulate Lattice-Gas Automata
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