The effect of ultrafast laser wavelength on ablation properties and implications on sample introduction in inductively coupled plasma mass spectrometry
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4812491
Reference53 articles.
1. High-temperature dielectric response in pulsed laser deposited Bi1.5Zn1.0Nb1.5O7 thin films
2. Micromachining of ridge optical waveguides on top of He[sup +]-implanted β-BaB[sub 2]O[sub 4] crystals by femtosecond laser ablation
3. Review of the State-of-the-Art of Laser Ablation Inductively Coupled Plasma Mass Spectrometry
4. Direct Determination of Trace Elements in Powdered Samples by In-Cell Isotope Dilution Femtosecond Laser Ablation ICPMS
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