Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
Author:
Affiliation:
1. Electronics R&I Division, Denso Corporation, Minamiyama 500-1 Komenoki-cho, Nisshin, Aichi 470-0111, Japan
2. Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5094073
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3. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly
4. Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications
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