Nanogap resistive switch mechanism study and performance degradation analysis

Author:

Yu Dacheng1ORCID,Tian Zhongzheng1ORCID,Ren Liming1,Fu Yunyi1ORCID

Affiliation:

1. School of Integrated Circuits, Peking University , Beijing, People's Republic of China

Abstract

The nanogap resistive switch holds potential as a candidate for nonvolatile memory, although its durability needs enhancement. This study delves into the operational mechanisms through detailed morphological examination during continuous operation of nanogap resistive switches. By developing a finite element model of nanogaps, we reveal the mechanisms behind the formation of electrode surface hillocks and filaments during continuous switching. Our findings suggest that “set” operations include processes such as field evaporation, electric field-induced diffusion, and field-assisted migration within the gap. Conversely, “reset” operations, driven by Joule heating and electromigration, lead to filament breakage and the creation of a fine gap. This research elucidates device degradation issues, such as periodic fluctuations in set threshold voltage (Vset) and the presence of non-steep set curves, providing both theoretical and experimental insights to improve future device performance.

Publisher

AIP Publishing

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