Design and characterization of ultra-stretchable monolithic silicon fabric-Reference-Cited by-同舟云学术

Design and characterization of ultra-stretchable monolithic silicon fabric

Published:2014-10-13 Issue:15 Volume:105 Page:154101
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Rojas J. P.¹²,Arevalo A.²³,Foulds I. G.³⁴,Hussain M. M.¹²

Affiliation:

1. Integrated Nanotechnology Lab, King Abdullah University of Science and Technology, 23955 Thuwal, Saudi Arabia

2. Computer, Electrical and Mathematical Sciences & Engineering Division, King Abdullah University of Science and Technology, 23955 Thuwal, Saudi Arabia

3. Electromechanical Microsystems & Polymer Integration Research Lab, King Abdullah University of Science and Technology, 23955 Thuwal, Saudi Arabia

4. School of Engineering, The University of British Columbia, Okanagan Campus, Kelowna, V1V 1V7 British Columbia, Canada

Funder

KAUST OCRF

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4898128

Reference28 articles.

1. Materials and Mechanics for Stretchable Electronics

2. Stretchable and self-healing polymers and devices for electronic skin

3. Large-scale complementary integrated circuits based on organic transistors

4. Ultrathin and lightweight organic solar cells with high flexibility

5. Conformable, flexible, large-area networks of pressure and thermal sensors with organic transistor active matrixes

Cited by 53 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics;Advanced Materials;2024-08-13

2. Material and structural approaches for human-machine interfaces;Smart and Connected Wearable Electronics;2024

3. A Hierarchical Theory for the Tensile Stiffness of Non-Buckling Fractal-Inspired Interconnects;Nanomaterials;2023-09-11

4. Mechanically-Guided 3D Assembly for Architected Flexible Electronics;Chemical Reviews;2023-09-07

5. A Review of Structure Engineering of Strain‐Tolerant Architectures for Stretchable Electronics;Small Methods;2023-09-03