Chemical role of oxygen plasma in wafer bonding using borosilicate glasses
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1418454
Reference12 articles.
1. Semiconductor wafer bonding: recent developments
2. Chemical Free Room Temperature Wafer To Wafer Direct Bonding
3. Low temperature direct bonding of non-hydrophilic surfaces
4. Oxidation and Induced Damage in Oxygen Plasma In Situ Wafer Bonding
5. Time-Dependent Surface Properties and Wafer Bonding of O[sub 2]-Plasma-Treated Silicon (100) Surfaces
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