Shape-and-solder-directed self-assembly to package semiconductor device segments
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1807017
Reference15 articles.
1. J. W. Sliwa Jr., US Patent No. 5,075,253 (1991).
2. Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates
3. J. S. Smith and H. J. J. Yeh, US Patent No. 5,824,186 (1998).
4. Forming Electrical Networks in Three Dimensions by Self-Assembly
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