Thermal contact to dielectric materials at low temperature
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1136802
Reference5 articles.
1. Selection of a thermal bonding agent for temperatures below 1 K
2. Cryostat for the Measurement of Thermal Conductivity and Specific Heat between 0.05 and 2°K
3. Analysis of heat transfer between solids at low temperatures
4. Calculations of the thermal boundary resistance
5. Instrumentation at temperatures below 1 K
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