Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires
Author:
Affiliation:
1. IBM Research at Albany Nanotech, 257 Fuller Road, Albany, New York 12203, USA
2. IBM T.J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, New York 10598, USA
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4983635
Reference48 articles.
1. Cobalt advanced barrier metallization: A resistivity composition analysis
2. The electron scattering at grain boundaries in tungsten films
3. Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films
4. Impact of surface and twin-boundary scattering on the electrical transport properties of Ag nanowires
5. A comparative study of quantum transport properties of silver and copper nanowires using first principles calculations
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Topological semimetal interface resistivity scaling for vertical interconnect applications;Applied Physics Letters;2024-04-29
2. Efficient device simulations using density functional theory Hamiltonian and non-equilibrium Green’s function: heterostructure mode space method and core charge approximation;Journal of Computational Electronics;2023-05-22
3. Size-Dependent Grain-Boundary Scattering in Topological Semimetals;Physical Review Applied;2022-09-21
4. Reliability and resistance projections for rhodium and iridium interconnects from first-principles;Journal of Vacuum Science & Technology B;2022-09
5. Spin-dependent electron scattering in cobalt interconnects;Journal of Physics D: Applied Physics;2019-09-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3