Thermal conductivity prediction by atomistic simulation methods: Recent advances and detailed comparison-Reference-Cited by-同舟云学术

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Thermal conductivity prediction by atomistic simulation methods: Recent advances and detailed comparison

Published:2021-12-07 Issue:21 Volume:130 Page:210902
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Gu Xiaokun¹^ORCID,Fan Zheyong²^ORCID,Bao Hua³^ORCID

Affiliation:

1. Institute of Engineering Thermophysics, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

2. College of Physical Science and Technology, Bohai University, Jinzhou 121013, China

3. University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China

Funder

National Natural Science Foundation of China

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0069175

Reference122 articles.

1. Nanoscale thermal transport

2. Nanoscale thermal transport. II. 2003–2012

3. Molecular dynamics simulation of thermal conductivity of silicon nanowires

4. Phonon Transport in Molecular Dynamics Simulations: Formulation and Thermal Conductivity Prediction

5. Intrinsic lattice thermal conductivity of semiconductors from first principles

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