Grain boundary segregation models for high-entropy alloys: Theoretical formulation and application to elucidate high-entropy grain boundaries

Author:

Luo Jian12ORCID

Affiliation:

1. Department of NanoEngineering, University of California San Diego 1 , La Jolla, California 92093, USA

2. Program in Materials Science and Engineering, University of California San Diego 2 , La Jolla, California 92093, USA

Abstract

Grain boundary (GB) segregation models are derived for multi-principal element alloys (MPEAs) and high-entropy alloys (HEAs). Differing from classical models where one component is taken as a solvent and others are considered solutes, these models are referenced to the bulk composition to enable improved treatments of MPEAs and HEAs with no principal components. An ideal solution model is first formulated and solved to obtain analytical expressions that predict GB segregation and GB energy in MPEAs and HEAs. A regular solution model is further derived. The GB composition calculated using the simple analytical expression derived in this study and data from the Materials Project agrees well with a prior atomistic simulation for NbMoTaW. The simplicity of the derived analytical expressions makes them useful for not only conveniently predicting GB segregation trends in HEAs but also analyzing nascent interfacial phenomena in compositionally complex GBs. As an application example, the models are used to further derive a set of equations to elucidate an emergent concept of high-entropy grain boundaries.

Funder

Army Research Office

Publisher

AIP Publishing

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3