Comment on ‘‘Aluminum cladding of highTcsuperconductor by thermocompression bonding’’ [Appl. Phys. Lett.53, 2342 (1988)]-Reference-Cited by-同舟云学术

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Comment on ‘‘Aluminum cladding of highTcsuperconductor by thermocompression bonding’’ [Appl. Phys. Lett.53, 2342 (1988)]

Published:1989-07-17 Issue:3 Volume:55 Page:321-321
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Harman G. G.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.102415

Reference4 articles.

1. Aluminum cladding of highTcsuperconductor by thermocompression bonding

2. Kirkendall effect and diffusion in the aluminium-silver system

3. Reliability Study of Wire Bonds to Silver Plated Surfaces

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Response to ‘‘Comment on ‘Aluminum cladding of highTcsuperconductor by thermocompression bonding’ ’’ [Appl. Phys. Lett.55, 321 (1989)];Applied Physics Letters;1989-07-17

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