Effect of grain size on thin film stress and morphology using kinetic Monte Carlo simulations
Author:
Affiliation:
1. School of Engineering, Brown University, Providence, Rhode Island 02912, USA
Funder
Division of Materials Research
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/am-pdf/10.1063/5.0023081
Reference34 articles.
1. Mechanisms inducing compressive stress during electrodeposition of Ni
2. Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films
3. Origins of residual stress in thin films: Interaction between microstructure and growth kinetics
4. Evolution of stress and structure in Cu thin films
5. Measurements of the intrinsic stress in thin metal films
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