Pulsed high rate plasma etching with variable Si/SiO2selectivity and variable Si etch profiles
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.96340
Reference4 articles.
1. Surface processes in plasma-assisted etching environments
2. Some features of RF excited fully ionized low pressure argon plasma
3. Very efficient plasma generation by whistler waves near the lower hybrid frequency
4. Heterogeneous fluorine atom recombination/reaction on several materials of construction
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