Damascene process simulation using molecular dynamics
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1519947
Reference15 articles.
1. Conformal copper deposition in deep trenches
2. Liner conformality in ionized magnetron sputter metal deposition processes
3. Simulations of trench-filling profiles under ionized magnetron sputter metal deposition
4. Molecular dynamics analysis of reflow process of sputtered aluminum films
5. Molecular dynamics simulation of sputter trench-filling morphology in damascene process
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Study on Sputtering of Copper Seed Layer for Interconnect Metallization via Molecular Dynamics Simulation;Applied Sciences;2021-10-18
2. Dual Damascene Simulation for Ionized Physical Vapor Deposition Process: Investigation on Incident Energy and Via Geometry Effects;Journal of the Physical Society of Japan;2003-12-15
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