Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint-Reference-Cited by-同舟云学术

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Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint

Published:2009-06-29 Issue:26 Volume:94 Page:263102
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Wong Cell K. Y.,Yuen Matthew M. F.,Xu Bing

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3167358

Reference13 articles.

1. Proceedings of the 55th Electronic Components and Technology Conference;Ogawa N.,2005

2. Proceedings of the 39th Electronic Components and Technology Conference;Kim S.,1989

3. Proceedings of the 50th Electronic Components and Technology Conference;Kim J. -K.,2000

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1. Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects;Journal of Industrial and Engineering Chemistry;2023-10

2. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors;Applied Surface Science;2023-01

3. Self-Healing and Reprocessable Oleic Acid-Based Elastomer with Dynamic S-S Bonds as Solvent-Free Reusable Adhesive on Copper Surface;Polymers;2022-11-14

4. Study of n-Alkanethiol Self-Assembly Behavior on Iron Particles: Effect of Alkyl Chain Length and Adsorption Solvent on Resulting Iron-Based Magnetorheological Fluids;Langmuir;2022-10-24

5. Chemical bonding copper and epoxy through self-assembled layer;2022 International Conference on Electronics Packaging (ICEP);2022-05-11

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