1. Department of Electrical and Electronic Engineering, The University of Hong Kong 1 , Hong Kong 999077, China
2. AI Chip Center for Emerging Smart Systems (ACCESS), The Hong Kong University of Science and Technology 2 , Hong Kong 999077, China
3. Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California 3 , Los Angeles, California 90089, USA
4. Department of Electrical Engineering and Computer Science, Syracuse University 4 , Syracuse, New York 13244, USA