Thermography pattern analysis and separation
Author:
Affiliation:
1. School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China
2. School of Electrical and Electronic Engineering, Newcastle University, England, United Kingdom
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Reference20 articles.
1. A calibration procedure for sonic infrared nondestructive evaluation
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4. Measurement of the Peltier coefficient of semiconductors by lock-in thermography
5. S. M. Shepard , 4th Pan American Conference for NDT, October 2007, Buenos Aires, Argentina.
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