Adhesion-delamination mechanics of a prestressed rectangular film adhered onto a rigid substrate

Author:

Wong Ming-Fung,Duan Gang,Wan Kai-Tak

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Analysis of Thermally Grown Oxides on Microperforated Copper Sheets;Journal of Materials Engineering and Performance;2023-05-24

2. Adherence of a hyperelastic shell on a rigid planar substrate;International Journal of Solids and Structures;2022-02

3. Effect of pressure on pull-off of punch adhered to circular or 1-D rectangular plate;International Journal of Non-Linear Mechanics;2021-12

4. Effect of pressure on pull-off of flat 1-D rectangular punch adhered to membrane;The Journal of Adhesion;2021-04-25

5. Strain energy release rate in shaft-loaded blister tests for composite repairs on steel;Composites Part A: Applied Science and Manufacturing;2016-02

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