Instrumented sphere method for measuring thermal pressure in fluids and isotropic stresses and reaction kinetics in thermosetting resins
Author:
Affiliation:
1. Department of Chemical Engineering, Texas Tech University, Lubbock, Texas 79409-3121
Publisher
AIP Publishing
Subject
Instrumentation
Reference20 articles.
1. C. Brahatheeswaran and V. B. Gupta, Polymer 34, 289 (1993).POLMAG0032-3861
2. Residual stress build-up in thermoset films cured above their ultimate glass transition temperature
3. A. R. Plepys and R. J. Farris, Polymer 31, 1932 (1990).POLMAG0032-3861
4. Verification of the capability for quantitative stress prediction during epoxy cure
5. P. Prasatya, G. B. McKenna, and S. L. Simon, J. Compos. Mater. 35, 826 (2001).JCOMBI0021-9983
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