Analysis of a picosecond ultrasonic method for measurement of stress in a substrate
Author:
Affiliation:
1. Rudolph Technologies, One Rudolph Road, P.O. Box 1000, Flanders, New Jersey 07836, USA
2. Department of Physics, Brown University, Providence, Rhode Island 02912, USA
Funder
Brown University (Brown)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4943541
Reference29 articles.
1. Thin Film Materials
2. Modeling contributions in commercialization of silicon ribbon growth from the melt
3. High-sensitivity strain mapping around epitaxial oxide nanostructures using scanning x-ray nanodiffraction
4. Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects
5. Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates
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