1. T. Burnettel, Z. Johnson, T. Koschmieder and W. Oyler, “Underfilled BGAs for Ceramic BGA Packages and Board-Level Reliability,” in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), (2000), pp. 1221–1226.
2. J. Roberts, M. Motalab, S. Hussain, J. C. Suhling, R. C. Jaeger and P. Lall, “Measurement of Die Stresses in Microprocessor Packaging Due to Thermal and Power Cycling,” in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, (2012), pp. 756–770.
3. Measurement of thermally induced die stresses in flip chip on laminate assemblies
4. Comparative study of micro-BGA reliability under bending stress
5. K. J. Puttlitz, T. Caulfield and M. Cole, “Effect of Material Properties on the Fatigue Life of Dual Solder (DS) Ceramic Ball Grid Array (CBGA) Solder Joints,” in 1995 Proceedings. 45th Electronic Components and Technology Conference, (1995), pp. 1005–1010.