Quantitative imaging of printed circuit board (PCB) delamination defects using laser-induced ultrasound scanning imaging-Reference-Cited by-同舟云学术

Quantitative imaging of printed circuit board (PCB) delamination defects using laser-induced ultrasound scanning imaging

Published:2022-02-07 Issue:5 Volume:131 Page:053101
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Wang Fei¹²^ORCID,Yue Zhuoyan¹²,Liu Junyan¹²^ORCID,Qi Hong³,Sun Wenjun⁴,Chen Mingjun¹,Wang Yang¹²,Yue Honghao¹²^ORCID

Affiliation:

1. School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, People's Republic of China

2. State Key Laboratory of Robotics and System (HIT), Harbin 150001, People's Republic of China

3. School of Energy Science and Engineering, Harbin Institute of Technology, Harbin 150001, People's Republic of China

4. School of Physics and Electronic Engineering, Harbin Normal University, Harbin 150001, People's Republic of China

Funder

National Postdoctoral Program for Innovative Talents

China Postdoctoral Science Foundation

Heilongjiang postdoctoral Fund

Aeronautical Science Foundation of China

National Natural Science Foundation of China

Self-planned Task of State Key Laboratory of Robotics and System, the Programme of Introducing Talents of Discipline of Universities

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0077766

Reference31 articles.

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4. C. Charette, S. Park, R. Williams, B. Banhabib, and K. C. Smith, in International Conference on Computer Integrated Manufacturing (1988), pp. 129–135, available at https://www.eecg.utoronto.ca/~pagiamt/kcsmith/kcsmith-automatic-pcb-inspection-1988.pdf.

5. B. Kaur, G. Kaur, and A. Kaur, in 2014 Recent Advances in Engineering and Computational Sciences (RAECS) (IEEE, 2014), pp. 1–5. https://doi.org/10.1109/RAECS.2014.6799537

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