Real time resistivity measurements during sputter deposition of ultrathin copper films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1430530
Reference23 articles.
1. Resistivity of Copper Films at Thicknesses Near the Mean Free Path of Electrons in Copper Minimization of the Diffuse Scattering in Copper
2. Thickness dependent electrical resistivity of ultrathin (<40 nm) Cu films
3. The in situ characterization of metal film resistance during deposition
4. In-situ conductance measurement of surface specularity of NiFe, Co, Cu, Ag and Ta thin films
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