Density functional theory study of the influence of segregation of S or Fe impurities on electromigration in nano-grained copper interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4919922
Reference34 articles.
1. Grain boundary structure of nanocrystalline Cu processed by cryomilling
2. On the effect of grain boundary segregation on electromigration driving force in thin metal films
3. Grain boundary self-diffusion in Cu polycrystals of different purity
4. Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines
5. Electromigration—A brief survey and some recent results
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Magnetic Moment on Carrier Effective Mass and Transport in Magnetic Nd2Fe14B Composite Bi2Te3 Films;The Journal of Physical Chemistry Letters;2024-06-24
2. Segregation of solute elements and their effects on the strength of Al Σ5 (210) [001] symmetrical tilt grain boundary in 2219 alloys;Materials Science and Engineering: A;2021-01
3. Uncovering the Zr segregation behavior and its effect on the fracture strength of Al Σ5 (210) [100] symmetrical tilt grain boundary: Insight from first principles calculation;Materials Today Communications;2020-12
4. Taguchi Approach and Response Surface Analysis for Design of a High-performance Single-walled Carbon Nanotube Bundle Interconnects in a Full Adder;International Journal of Engineering;2020-08
5. Segregation of Sc and its effects on the strength of Al Σ5 (210) [100] symmetrical tilt grain boundary;Materials Science and Engineering: A;2019-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3