Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2117633
Reference19 articles.
1. Crack formation in TiN films deposited on Pa-n due to large thermal mismatch
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5. Crack formation in TiN films deposited on Pa-n due to large thermal mismatch
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