Author:
Wei Frank L.,Hau-Riege Christine S.,Marathe Amit P.,Thompson Carl V.
Subject
General Physics and Astronomy
Reference25 articles.
1. DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
2. Stress evolution due to electromigration in confined metal lines
3. Modeling electromigration‐induced stress evolution in confined metal lines
4. Z.S. Choi, C. L. Gan, F. Wei, C. V. Thompson, J. H. Lee, K. L. Pey, and W. K. Choi, Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics—2004, MRS Symposia Proceedings No. 812 (Materials Research Society, Pittsburgh, 2004), p. 373.
5. The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects
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