A transverse‐wave ultrasonic oblique‐incidence technique for interfacial weakness detection in adhesive bonds
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.340294
Reference13 articles.
1. Study of adhesive bonds using low‐frequency obliquely incident ultrasonic waves
2. An ultrasonic interface‐wave method for predicting the strength of adhesive bonds
3. Shear modulus gradients in adhesive interfaces as determined by means of ultrasonic Rayleigh waves
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