Effect of interfacial atomic mixing on the thermal conductivity of multi-layered stacking structure
Author:
Affiliation:
1. Department of Power Engineering, School of Energy and Power Engineering, North China Electric Power University, Baoding 071003, China
2. Physics Department, Missouri University of Science and Technology, Rolla, Missouri 65409, USA
Funder
National Natural Science Foundation of China
Natural Science Foundation of Hebei Province
Fundamental Research Funds for the Central Universities
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0078669
Reference42 articles.
1. Nanoscale thermal transport
2. Influence of thermostatting on nonequilibrium molecular dynamics simulations of heat conduction in solids
3. Lattice-dynamical calculation of phonon scattering at ideal Si–Ge interfaces
4. Size-dependent phononic thermal transport in low-dimensional nanomaterials
5. Effect of thin film confined between two dissimilar solids on interfacial thermal resistance
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