Atomic hydrogen enhanced reflow of copper
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.118541
Reference7 articles.
1. Activation energy for electromigration in Cu films
2. Double-level copper interconnections using selective copper CVD
3. Atomic hydrogen adsorption on sintered thin copper films
4. H2Dissociation at Metal Surfaces
5. H-enhanced mobility and defect formation at surfaces: H on Be(0001)
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1. Selective Filling and Sintering of Copper Nanoclusters for Interconnect;IEEE Transactions On Nanotechnology;2007-09
2. Effect of H2Addition during Cu Thin-Film Sputtering;Japanese Journal of Applied Physics;2006-12-07
3. Low-temperature annealing of ion-doped layers of silicon in hydrogen atom flow;SPIE Proceedings;2006-05-24
4. Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology;Thin Solid Films;2004-09
5. Effect of hydrogen remote plasma annealing on the characteristics of copper film;Thin Solid Films;2003-04
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