A quantitative strain analysis of a flexible single-crystalline silicon membrane-Reference-Cited by-同舟云学术

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A quantitative strain analysis of a flexible single-crystalline silicon membrane

Published:2017-01-16 Issue:3 Volume:110 Page:033105
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Bong Jae Hoon¹^ORCID,Kim Cheolgyu²,Hwang Wan Sik³,Kim Taek-Soo²,Cho Byung Jin¹^ORCID

Affiliation:

1. School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea

2. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea

3. Department of Materials Engineering, Korea Aerospace University, Goyang 10540, South Korea

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4974078

Reference30 articles.

1. Organic electronics on paper

2. Ultrathin and lightweight organic solar cells with high flexibility

3. High performance organic transistor active-matrix driver developed on paper substrate

4. Flexible organic transistors on standard printing paper and memory properties induced by floated gate electrode

5. Flexible suspended gate organic thin-film transistors for ultra-sensitive pressure detection

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1. Enhancing flexibility in BaTiO3:Sm3+ freestanding nanofiber membranes through Poisson's ratio design;Applied Physics Letters;2024-04-22

2. Investigation of effective stress imposed on flexible single-crystalline semiconductor nanomembrane electronics under bending conditions;Modern Physics Letters B;2022-05-20

3. Flexible Hybrid Single-Crystalline Silicon Nanomembrane Thin-Film Transistor with Organic Polymeric Polystyrene as a Gate Dielectric on a Plastic Substrate;ACS Applied Electronic Materials;2022-04-22

4. Over 65% Sunlight Absorption in a 1 μm Si Slab with Hyperuniform Texture;ACS Photonics;2022-03-22

5. A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics;Journal of Physics D: Applied Physics;2021-11-17

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