Enhanced thermoelectric properties of nanostructured Si by excess P-doping

Abstract

In this study, nanostructures were introduced into bulk Si, and the P content in Si was increased. Arc melting, ball milling, and spark plasma sintering were used to prepare excess P-doped Si samples (Si1−xPx, x = 0.01, 0.03, 0.06, 0.09, and 0.12). In Si0.94P0.06, thermal conductivity decreased to 18 W m−1 K−1 at room temperature, which is about 10% of that of bulk Si. Transmission electron microscopy observation of Si0.94P0.06 revealed a linearly localized alignment, in addition to the nanostructures observed in the previous studies of P-doped Si samples. Linear alignments were composed of Si-P nanoprecipitates and defects linearly localized around dislocations. These sub-microstructures can reduce thermal conductivity; as a result, ZT at 973 K increased to 0.43, which is approximately three times higher than that of single-crystal Si.