Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon-Reference-Cited by-同舟云学术

Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Published:2007-05-21 Issue:21 Volume:90 Page:213501
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Ahn Jong-Hyun,Kim Hoon-Sik,Menard Etienne,Lee Keon Jae,Zhu Zhengtao,Kim Dae-Hyeong,Nuzzo Ralph G.,Rogers John A.,Amlani Islamshah,Kushner Vadim,Thomas Shawn G.,Duenas Terrisa

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2742294

Reference13 articles.

1. Organic thin-film electronics from vitreous solution-processed rubrene hypereutectics

2. High-speed mechanically flexible single-crystal silicon thin-film transistors on plastic substrates

3. Transparent ZnO thin-film transistor fabricated by rf magnetron sputtering

4. Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers

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