A simple numerical method for evaluating heat dissipation from curved wires with periodic applied heating-Reference-Cited by-同舟云学术

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A simple numerical method for evaluating heat dissipation from curved wires with periodic applied heating

Published:2021-10-18 Issue:16 Volume:119 Page:163501
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Jaffe Gabriel R.¹^ORCID,Brar Victor W.¹,Lagally Max G.²,Eriksson Mark A.¹^ORCID

Affiliation:

1. Department of Physics, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

2. Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA

Funder

US DOE Basic Energy Sciences

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0059648

Reference21 articles.

1. Nanoscale thermal transport

2. Energy dissipation and transport in nanoscale devices

3. Thermal conductivity measurement from 30 to 750 K: the 3ω method

4. Heat transport in thin dielectric films

5. Thermal boundary resistance at Ge2Sb2Te5/ZnS:SiO2 interface

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Digital Determination of the Thermal Conductivity of a Square Bar by Reduction to a System of Integral Equations;Advances in Science, Technology & Innovation;2024

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