Chip-carrier thermal barrier and its impact on lateral thermal lens profile and beam parameter product in high power broad area lasers
Author:
Affiliation:
1. Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Str. 4, 12489 Berlin, Germany
2. Max-Born-Institut für Nichtlineare Optik und Kurzzeitspektroskopie, Max-Born-Str. 2A, 12489 Berlin, Germany
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5004503
Reference36 articles.
1. Experimental investigation of factors limiting slow axis beam quality in 9xx nm high power broad area diode lasers
2. Novel approaches to increasing the brightness of broad area lasers
3. Inverse Thermal Lens Effects on the Far-Field Blooming of Broad Area Laser Diodes
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