Fluorine-enhanced low-temperature wafer bonding of native-oxide covered Si wafers-Reference-Cited by-同舟云学术

Fluorine-enhanced low-temperature wafer bonding of native-oxide covered Si wafers

Published:2004-10-25 Issue:17 Volume:85 Page:3731-3733
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Tong Q.-Y.,Gan Q.,Fountain G.,Enquist P.,Scholz R.,Gösele U.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1809279

Reference14 articles.

1. D. R. Ciarlo, in Proceedings of the Second International Symposium on Semiconductor Wafer Bonding, Science, Technology and Applications Vol. 93-29 (The Electrochemical Society, Pennington, NJ, 1993), p. 313.

2. Silicon‐to‐silicon direct bonding method

3. A Model of Low‐Temperature Wafer Bonding And Its Applications

4. Chemical Free Room Temperature Wafer To Wafer Direct Bonding

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