Impact of the contact's geometry on the line resistivity of carbon nanotubes bundles for applications as horizontal interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4817648
Reference22 articles.
1. Scaling of Resistance and Electron Mean Free Path of Single-Walled Carbon Nanotubes
2. Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects
3. Determination of the Intershell Conductance in Multiwalled Carbon Nanotubes
4. Role of Fermi-Level Pinning in Nanotube Schottky Diodes
5. Carbon nanotubes horizontal interconnects with end-bonded contacts, diameters down to 50nm and lengths up to 20μm
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