Stress evolution in surrounding silicon of Cu-filled through-silicon via undergoing thermal annealing by multiwavelength micro-Raman spectroscopy
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3596443
Reference5 articles.
1. Uniaxial-process-induced strained-Si: extending the CMOS roadmap
2. A 90-nm Logic Technology Featuring Strained-Silicon
3. Measurement of Strain in Locally Oxidized Silicon using Convergent-Beam Electron Diffraction
4. Design of Multi-Wavelength Micro Raman Spectroscopy System and Its Semiconductor Stress Depth Profiling Applications
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