Interfacial cracks near an eccentric circular hole in piezoelectric bi-materials subjected to dynamic incident anti-plane shearing-Reference-Cited by-同舟云学术

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Interfacial cracks near an eccentric circular hole in piezoelectric bi-materials subjected to dynamic incident anti-plane shearing

Published:2020-05-01 Issue:5 Volume:10 Page:055009
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

An Ni¹^ORCID,Song Tian-shu¹,Hou Gangling¹

Affiliation:

1. College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, People’s Republic of China

Funder

The National Science and Technology Major Project of the Ministry of Science and Technology of China, Large Advanced PWR Nuclear Power Station

Chinese Universities Scientific Fund

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5110575

Reference12 articles.

1. Linear electro-elastic fracture mechanics of piezoelectric materials

2. Crack Extension Force in a Piezoelectric Material

3. Plane problems in piezoelectric media with defects

4. Mode‐III cracks in piezoelectric materials

5. Electroelastic fracture dynamics for multilayered piezoelectric materials under dynamic anti-plane shearing

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Model of branched crack and hole defects in finite plane;Theoretical and Applied Fracture Mechanics;2024-04

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