Time‐of‐flight study on the thermal etching of Al with Cl2
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.99046
Reference14 articles.
1. Ion-beam assisted etching of semiconductors
2. Argon‐ion assisted etching of silicon by molecular chlorine
3. Studies on the mechanism of chemical sputtering of silicon by simultaneous exposure to Cl2 and low-energy Ar+ ions
4. Magnetically suspended cross‐correlation chopper in molecular beam‐surface experiments
5. A detailed evaluation of the mechanical correlation chopper for neutron time-of-flight spectrometry
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