Structure, chain orientation, and properties in thin films of aromatic polyimides with various chain rigidities
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.364210
Reference31 articles.
1. Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides
2. In-plane orientation of polyimide
3. The effect of orientation on thermal expansion behavior in polyimide films
4. Stress in polyimide coatings
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