Interdiffusion and stress development in single-crystalline Pd/Ag bilayers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4945673
Reference82 articles.
1. E. J. Mittemeijer , Fundamentals of Materials Science ( Springer, Berlin/Heidelberg, 2010), Chap. 8, pp. 438–439.
2. Mechanisms of interdiffusion in Pd–Cu thin film diffusion couples
3. Interface reaction and a special form of grain boundary diffusion in the Cr-W system
4. Recrystallization and interdiffusion in thin bimetallic films
5. The hidden link between diffusion-induced recrystallization and ideal strength of metals
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