Thermal stability of cobalt silicide thin films on Si(100)
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.354950
Reference20 articles.
1. Self-aligned silicide technology for ultra-thin SIMOX MOSFETs
2. The use of disposable double spacer and self-aligned cobalt silicide for LDD MOSFET fabrication
3. Characterization and implementation of self-aligned TiSi/sub 2/ in submicrometer CMOS technology
4. High Temperature Process Limitation on TiSi2
5. Formation of self-aligned cobalt silicide in normal flow nitrogen furnace
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1. Self-Controlled Synthesis of Microscale Silicide Embossments and Pits with Multi-Shape and Orientation;Nanoscience and Nanotechnology Letters;2015-11-01
2. Shape-Controlled Fabrication of Micro/Nanoscale Triangle, Square, Wire-like, and Hexagon Pits on Silicon Substrates Induced by Anisotropic Diffusion and Silicide Sublimation;ACS Nano;2010-04-20
3. Characteristics of DC magnetron sputtered ternary cobalt–nickel silicide thin films for ultra shallow junction devices;Microelectronic Engineering;2008-03
4. Oxide-mediated formation of epitaxy silicide on heavily doped Si surfaces and narrow width active region;Thin Solid Films;2006-03
5. CoSi[sub x] thermal stability on narrow-width polysilicon resistors;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006
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