Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node-Reference-Cited by-同舟云学术

Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

Published:2015-01-05 Issue:1 Volume:106 Page:014105
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Yin Lan¹,Bozler Carl²,Harburg Daniel V.¹,Omenetto Fiorenzo³,Rogers John A.¹

Affiliation:

1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S Goodwin Ave., Urbana, Illinois 61801, USA

2. Lincoln Laboratory, Massachusetts Institute of Technology, 244 Wood Street, Lexington, Massachusetts 02420, USA

3. Department of Biomedical Engineering, Department of Physics, Tufts University, 4 Colby St., Medford, Massachusetts 02155, USA

Funder

DARPA

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4905321

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