Atomistic studies of segregation and diffusion in Al-Cu grain boundaries
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.121120
Reference9 articles.
1. Electromigration and failure in electronics: An introduction
2. Electromigration and failure in electronics: An introduction
3. Effect of Alloy Additions on Electromigration Failures in Thin Aluminum Films
4. Effect of Alloy Additions on Electromigration Failures in Thin Aluminum Films
5. Effect of Alloy Additions on Electromigration Failures in Thin Aluminum Films
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