Molecular dynamics investigation of the slip flow liquid–solid interfacial thermal conductance
Author:
Affiliation:
1. School of Software and Microelectronics, Peking University, Beijing 102600, People’s Republic of China
2. The 13th Research Institute of CETC, Shijiazhuang 050051, People’s Republic of China
Funder
Chinese Equipment Pre-research Field Foundation Key Project
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0050291
Reference45 articles.
1. Recent Advances in High-Flux, Two-Phase Thermal Management
2. Molecular dynamic simulation of diamond/silicon interfacial thermal conductance
3. Molecular dynamics simulations of carbon nanotube/silicon interfacial thermal conductance
4. Molecular dynamics simulation of interfacial thermal conductance between silicon and amorphous polyethylene
5. A molecular dynamics study on heat conduction characteristics in DPPC lipid bilayer
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