Thermal dissipation induced by fast-moving edge dislocations

Author:

Xiong Qi-Lin12ORCID,Shimada Takahiro3,Kitamura Takayuki3

Affiliation:

1. Department of Mechanics, School of Aerospace Engineering, Huazhong University of Science and Technology 1 , 1037 Luoyu Road, Wuhan 430074, China

2. Hubei Key Laboratory of Engineering Structural Analysis and Safety Assessment 2 , 1037 Luoyu Road, Wuhan 430074, China

3. Department of Mechanical Engineering and Science, Kyoto University 3 , Nishikyo-ku, Kyoto 615-8540, Japan

Abstract

Microscopic mechanics of thermal dissipation induced by fast-moving edge dislocations are crucial for a deeper understanding of the nature of plastic deformation. Herein, we study the thermal dissipation induced by a fast-moving edge dislocation and discuss the effect of non-Schmid stress on the thermal dissipation using molecular dynamics simulations that can quantitatively distinguish the thermal dissipation and stored energy part of the energy emitted from a moving dislocation. We show that, of the energy emitted by the fast-moving edge dislocation, no more than 5% is used to generate elastic distortion of the local atomic structure, especially at low-stress levels, and almost all the energy emitted by the moving dislocation is converted into thermal energy and dissipated. The thermal dissipation of the moving edge dislocation depends significantly on the non-Schmid stress, specifically, temperature rise decreases almost linearly as the non-Schmid stress normal to the slip plane increases, and the possible mechanism is disclosed.

Funder

National Natural Science Foundation of China

Fundamental Research Funds For Central Universities of HUST

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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