The role of surface energy anisotropy in the formation of a stepped relief of polycrystalline W under sputtering with Ar ions-Reference-Cited by-同舟云学术

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The role of surface energy anisotropy in the formation of a stepped relief of polycrystalline W under sputtering with Ar ions

Published:2019-02-14 Issue:6 Volume:125 Page:065307
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Savchenko A. A.¹,Belyaeva A. I.¹,Galuza A. A.²^ORCID,Kolenov I. V.³

Affiliation:

1. Department of Physics, National Technical University “Kharkiv Polytechnic Institute,” Kharkiv 61002, Ukraine

2. Department of Computer Mathematics and Data Analysis, National Technical University “Kharkiv Polytechnic Institute,” Kharkiv 61002, Ukraine

3. Institute of Electrophysics and Radiation Technologies, NAS of Ukraine, Kharkiv 61002, Ukraine

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5081788

Reference27 articles.

1. Materials and surface engineering

2. Handbook of Materials Characterization

3. Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets

4. Surface Topography and Deuterium Retention of Polycrystalline Tungsten and Nanocrystalline Tungsten Film Exposed to Deuterium Plasma

5. Study of grain growth and thermal stability of nanocrystalline RuAl thin films deposited by magnetron sputtering

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