Characterization and role of deep traps on the radio frequency performances of high resistivity substrates

Author:

Vandermolen Eric12ORCID,Ferrandis Philippe3ORCID,Allibert Frédéric2ORCID,Nabet Massinissa4ORCID,Rack Martin4ORCID,Raskin Jean-Pierre4ORCID,Cassé Mikaël1ORCID

Affiliation:

1. CEA, LETI, Univ. Grenoble Alpes, 38000 Grenoble, France

2. SOITEC, Parc technologique des fontaines, 38190 Bernin, France

3. Université de Toulon, Univ. Grenoble Alpes, CNRS, Institut Néel, 38000 Grenoble, France

4. ICTEAM, Université catholique de Louvain, 1348 Louvain-la-Neuve, Belgium

Funder

Association Nationale de la Recherche et de la Technologie

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Reference43 articles.

1. Low-loss CPW lines on surface stabilized high-resistivity silicon

2. New substrate passivation method dedicated to HR SOI wafer fabrication with increased substrate resistivity

3. C. Roda Neve, K. Ben Ali, C. Malaquin, F. Allibert, E. Desbonnets, I. Bertrand, W. Van Den Daele, and J.P. Raskin, in 2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (IEEE, 2013), pp. 15–17.

4. L. Zhu, S. Liu, F. Allibert, E. Desbonnets, I. Radu, X. Zhu, and Y. Lu, in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (IEEE, 2016), pp. 1–2.

5. RF Performance of SOI CMOS Technology on Commercial 200-mm Enhanced Signal Integrity High Resistivity SOI Substrate

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